Standards

ASTM E2246 - 11


ASTM E2246 - 11 Standard Test Method for Strain Gradient Measurements of Thin, Reflecting Films Using an Optical Interferometer


Active Standard ASTM E2246 Developed by Subcommittee: E08.05 |Book of Standards Volume: 03.01

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ASTM E2246

Significance and Use

Strain gradient values are an aid in the design and fabrication of MEMS devices.

1. Scope

1.1 This test method covers a procedure for measuring the strain gradient in thin, reflecting films. It applies only to films, such as found in microelectromechanical systems (MEMS) materials, which can be imaged using an optical interferometer, also called an interferometric microscope. Measurements from cantilevers that are touching the underlying layer are not accepted.

1.2 This test method uses a non-contact optical interferometric microscope with the capability of obtaining topographical 3-D data sets. It is performed in the laboratory.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.


2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

E2244 Test Method for In-Plane Length Measurements of Thin, Reflecting Films Using an Optical Interferometer

E2245 Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical Interferometer

E2444 Terminology Relating to Measurements Taken on Thin, Reflecting Films

E2530 Practice for Calibrating the Z-Magnification of an Atomic Force Microscope at Subnanometer Displacement Levels Using Si(111) Monatomic Steps

SEMI Standard

MS2 Test Method for Step Height Measurements of Thin Films



Keywords

cantilevers; combined standard uncertainty; fixed-fixed beams; interferometry; length measurements; microelectromechanical systems; MEMS; polysilicon; residual strain; round robin; stiction; strain gradient; test structure; Alignment; Calibration--metals/alloys analysis instrumentation; Cantilever testing; Combined standard uncertainty; Fixed-fixed beams; Interferograms/Interferometry; Length; Microelectromechanical systems (MEMS); Noncontacting optical strain measurement systems; Polysilicon materials/applications; Residual strains; Stiction; Strain gradient; Thin film applications



ICS Code

ICS Number Code 37.040.20 (Photographic paper, film and plates. Cartridges)



DOI: 10.1520/E2246-11

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