Methods and procedures used in installing bonded resistance strain gages can have significant effects upon the performance of those sensors. Optimum and reproducible detection of surface deformation requires appropriate and consistent surface preparation, mounting procedures, and verification techniques.

1. Scope

1.1 This guide provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages.

1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

E251 Test Methods for Performance Characteristics of Metallic Bonded Resistance Strain Gauges

Other Standards

Keywords

Adhesive bonds; Base-metal substrates; Bonded resistance strain gages; Bonding; Bond strength; Electrical measurements; Environmental control/fate; Etched foil resistance strain gages; Expansion; Heating tests--metals; Installation; Resistance; Resistance gages; Solder/soldering applications; Strain gages; Strain testing--metallic materials; Stress--metallic materials; Thermal coefficient of expansion; Verification; Adhesion;

ICS Code

ICS Number Code 19.060 (Mechanical testing)

Citing ASTM Standards

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