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Significance and Use
Methods and procedures used in installing bonded resistance strain gages can have significant effects upon the performance of those sensors. Optimum and reproducible detection of surface deformation requires appropriate and consistent surface preparation, mounting procedures, and verification techniques.
1.1 This guide provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages.
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
E251 Test Methods for Performance Characteristics of Metallic Bonded Resistance Strain Gauges
Other StandardsANSI/SEM1-1984; Standard for Portable Strain-Indicating InstrumentsDesignation of Strain Gage Bridge and Color Code of Terminal Connections; August 16, 1984. Available from American National Standards Institute, 11 W. 42nd St., 13th floor, New York, NY 10036.
ICS Number Code 19.060 (Mechanical testing)
UNSPSC Code 41111605(Strain gauges)