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Significance and Use
4.1 This practice establishes the basic minimum parameters and controls for the application of radiological examination of electronic devices. Factors such as device handling, equipment, ESDS, materials, personnel qualification, procedure and quality requirements, reporting, records and radiation sensitivity are addressed. This practice is written so it can be specified on the engineering drawing, specification or contract. It is not a detailed how-to procedure and must be supplemented by a detailed examination technique/procedure (see ).
4.2 This practice does not set limits on radiation dose, but does list requirements to limit and document radiation dose to devices. When radiation dose limits are an issue, the requestor of radiological examinations must be cognizant of this issue and state any maximum radiation dose limitations that are required in the contractual agreement between the using parties.
1.1 This practice provides the minimum requirements for nondestructive radiologic examination of semiconductor devices, microelectronic devices, electromagnetic devices, electronic and electrical devices, and the materials used for construction of these items.
1.2 This practice covers the radiologic examination of these items to detect possible defective conditions within the sealed case, especially those resulting from sealing the lid to the case, and internal defects such as extraneous material (foreign objects), improper interconnecting wires, voids in the die attach material or in the glass (when sealing glass is used) or physical damage.
1.3 The values stated in inch-pound units are to be regarded as standard. No other units of measurement are included in this practice.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
E94 Guide for Radiographic Examination
E431 Guide to Interpretation of Radiographs of Semiconductors and Related Devices
E543 Specification for Agencies Performing Nondestructive Testing
E666 Practice for Calculating Absorbed Dose From Gamma or X Radiation
E801 Practice for Controlling Quality of Radiological Examination of Electronic Devices
E999 Guide for Controlling the Quality of Industrial Radiographic Film Processing
E1000 Guide for Radioscopy
E1255 Practice for Radioscopy
E1316 Terminology for Nondestructive Examinations
E1411 Practice for Qualification of Radioscopic Systems
E1453 Guide for Storage of Magnetic Tape Media that Contains Analog or Digital Radioscopic Data
E1475 Guide for Data Fields for Computerized Transfer of Digital Radiological Examination Data
E1742 Practice for Radiographic Examination
E1815 Test Method for Classification of Film Systems for Industrial Radiography
E1817 Practice for Controlling Quality of Radiological Examination by Using Representative Quality Indicators (RQIs)
E2339 Practice for Digital Imaging and Communication in Nondestructive Evaluation (DICONDE)
E2597 Practice for Manufacturing Characterization of Digital Detector Arrays
ANSI StandardsANSI/ESD S20.20 ESD Association Standard for the Development of an Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)
ICS Number Code 31.080.01 (Semi-conductor devices in general)
UNSPSC Code 32111700(Semiconductor devices); 32101600(Integrated circuits)
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ASTM E1161-09(2014), Standard Practice for Radiologic Examination of Semiconductors and Electronic Components, ASTM International, West Conshohocken, PA, 2014, www.astm.orgBack to Top