1.1 These test methods cover photometric procedures for the chemical analysis of nickel, intended primarily for use in electronic devices, having a chemical composition within the following limits: Element Concentration Range, % Nickel 94 to 100 Copper 0.005 to 0.3 Iron 0.0035 to 0.3 Cobalt 0.05 to 1.0 Manganese 0.02 to 0.5 Titanium 0.0005 to 0.5 Silicon 0.001 to 0.3 Aluminum 0.01 to 0.35 Carbon 0.001 to 0.10 Hydrogen 0.0001 to 0.01 Nitrogen 0.0001 to 0.01 Oxygen 0.001 to 0.10 Tungsten 3.0 to 5.0 Magnesium 0.005 to 0.2
1.2 The techniques and procedures covered in these test methods have been chosen so as to keep the consumption of sample to a minimum.
1.3 The analytical procedures appear in the following order: (This standard contains more than one test method for some elements. In some cases, the use of multiple test methods is needed to cover the concentration range of the scope of the standard; in others, multiple test methods are supplied to allow for variations in availability of instruments and other facilities among laboratories.) Sections Copper by the Hydrobromic Acid (Photometric) Method 8 to 15 Iron by the Thiocyanate (Photometric) Method 16 to 24 Cobalt by the Nitroso-R-Salt (Photometric) Method 25 to 32 Manganese by the Periodate (Photometric) Method 33 to 40 Titanium by the Tiron (Photometric) Method 41 to 48 Silicon by the Molybdenum Blue (Photometric) Method 49 to 56 Aluminum by the Aluminon (Photometric) Method 57 to 64 Carbon by the Low-Pressure Combustion Method 65 to 73 Hydrogen, Nitrogen, and Oxygen by the Vacuum Fusion Method 74 to 78 Copper by the Neocuproine (Photometric) Method 79 to 87 Tungsten by the Acid Digestion-Cinchonine (Gravimetric) Method 88 to 92 Magnesium by the 8-Hydroxyquinoline (Photometric) Method 93 to 102
1.4 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. Specific hazard statements are given in Section 5.
Aluminum content-Ni/Ni alloys; Cobalt content-Ni/Ni alloys; Copper content-nickel; Hydrogen content; Iron content-Ni/Ni alloys; Magnesium content-Ni/Ni alloys; Manganese content-Ni/Ni alloys; Nickel-electronic applications; Nitrogen content-Ni/Ni alloys; Oxygen content-metals/alloys; Silicon content-Ni/Ni alloys; Titanium content-Ni/Ni alloys; Tungsten content-Ni/Ni alloys; chemical analysis of electronic nickel, methods;
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