Abstract
These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows: dielectric breakdown voltage parallel to laminations; dimensional instability; dissipation factor; flammability rating; flatwise flexural strength at room and elevated temperatures; behavior during oven blister test; peel strength at room and elevated temperatures; permittivity; pin holes and scratches in copper surface; purity of copper; behavior upong solder float test; solvent resistance; surface and volume resistivity; thickness; warp or twist; and water absorption.
This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.
1. Scope
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
1.2 The procedures appear in the following sections:
| Procedure | Section |
| Referenced Documents | 2 |
| Conditioning | 4 |
| Dielectric Breakdown Voltage Parallel to Laminations | 13 |
| Dimensional Instability | 19 |
| Dissipation Factor | 14 |
| Flammability Rating Test | 16 |
| Flexural Strength, Flatwise at Elevated Temperature | 15 |
| Flexural Strength, Flatwise at Room Temperature | 15 |
| Oven Blister Test | 17 |
| Peel Strength Test at Elevated Temperature | 10 |
| Peel Strength Test at Room Temperature | 9 |
| Permittivity | 14 |
| Pin Holes in Copper Surface | 20 |
| Purity of Copper | 5 |
| Scratches in Copper Surface | 21 |
| Solder Float Test | 8 |
| Solvent Resistance | 7 |
| Surface Resistivity | 11 |
| Volume Resistivity | 11 |
| Terminology | 3 |
| Thickness & Thickness Variation | 18 |
| Warp or Twist | 6 |
| Water Absorption | 12 |
1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.
2. Referenced Documents (purchase separately) 
The documents listed below are referenced within the subject standard but are not provided as part of the standard.
ASTM Standards
D150 Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation
D229 Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation
D257 Test Methods for DC Resistance or Conductance of Insulating Materials
D374 Test Methods for Thickness of Solid Electrical Insulation
D618 Practice for Conditioning Plastics for Testing
D1531 Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures
D1711 Terminology Relating to Electrical Insulation
D1825 Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing
D1867 Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
D3636 Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
E53 Test Method for Determination of Copper in Unalloyed Copper by Gravimetry
Other Standard
NEMAPublicationNumbe Test for Hot Peel Strength of Copper-Clad Industrial Laminates for Printed Circuits Available from National Electronic Manufacturers Association (NEMA), 2101 L St., NW, Washington, DC 20037.
Keywords
copper-clad laminate; dielectric breakdown parallel to laminations; dimensional instability; dissipation factor; fiber reinforced; flexural strength; industrial laminate; laminate; oven blister; peel strength; permittivity; printed circuit boards; printed wiring boards; rigid laminate; solder float; surface resistivity; thermoset; thickness variation; trace; twist; volume resistivity; warp; water absorption ;
ICS Code
ICS Number Code 31.180 (Printed circuits and boards); 83.140.20 (Laminated sheets)
DOI: 10.1520/D5109-12
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