ASTM D5109 - 12

    Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

    Active Standard ASTM D5109 | Developed by Subcommittee: D09.07

    Book of Standards Volume: 10.02

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    These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows: dielectric breakdown voltage parallel to laminations; dimensional instability; dissipation factor; flammability rating; flatwise flexural strength at room and elevated temperatures; behavior during oven blister test; peel strength at room and elevated temperatures; permittivity; pin holes and scratches in copper surface; purity of copper; behavior upong solder float test; solvent resistance; surface and volume resistivity; thickness; warp or twist; and water absorption.

    This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.

    1. Scope

    1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

    1.2 The procedures appear in the following sections:



     Referenced Documents




     Dielectric Breakdown Voltage Parallel to Laminations


     Dimensional Instability


     Dissipation Factor


     Flammability Rating Test


     Flexural Strength, Flatwise at Elevated Temperature


     Flexural Strength, Flatwise at Room Temperature


     Oven Blister Test


     Peel Strength Test at Elevated Temperature


     Peel Strength Test at Room Temperature




     Pin Holes in Copper Surface


     Purity of Copper


     Scratches in Copper Surface


     Solder Float Test


     Solvent Resistance


     Surface Resistivity


     Volume Resistivity




     Thickness & Thickness Variation


     Warp or Twist


     Water Absorption


    1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

    1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

    2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

    ASTM Standards

    D150 Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation

    D229 Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation

    D257 Test Methods for DC Resistance or Conductance of Insulating Materials

    D374 Test Methods for Thickness of Solid Electrical Insulation

    D618 Practice for Conditioning Plastics for Testing

    D1531 Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures

    D1711 Terminology Relating to Electrical Insulation

    D1825 Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing

    D1867 Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

    D3636 Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials

    E53 Test Method for Determination of Copper in Unalloyed Copper by Gravimetry

    Other Standard

    NEMA Publication Number LI 1-1975 Test for Hot Peel Strength of Copper-Clad Industrial Laminates for Printed Circuits Available from National Electronic Manufacturers Association (NEMA), 2101 L St., NW, Washington, DC 20037.

    ICS Code

    ICS Number Code 31.180 (Printed circuits and boards); 83.140.20 (Laminated sheets)

    UNSPSC Code

    UNSPSC Code 32101510(Printed wire boards)

    Referencing This Standard
    Link Here
    Link to Active (This link will always route to the current Active version of the standard.)

    DOI: 10.1520/D5109-12

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    Citation Format

    ASTM D5109-12, Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards, ASTM International, West Conshohocken, PA, 2012,

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