| ||Format||Pages||Price|| |
|2||$39.00||  ADD TO CART|
|Hardcopy (shipping and handling)||2||$39.00||  ADD TO CART|
Significance and Use
5.1 This is a quick, simple, and inexpensive test method for qualitatively determining, without the need to prepare bonded test specimens, whether the adhesive under consideration will bond to a particular substrate. If the results are acceptable, then standard quantitative adhesive test procedures can be used to obtain quantitative measurements of the adhesive's performance.
5.6 It should be most applicable to adhesives that cure or set when exposed to “air” (ambient, heated, etc.) and could be used for anaerobic adhesives if testing is carried out in an oxygen-free atmosphere.
1.1 This test method covers a simple qualitative procedure for quickly screening whether an adhesive will, under recommended application conditions, bond to a given substrate without actually making bonded assemblies.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
D907 Terminology of Adhesives
E171 Practice for Conditioning and Testing Flexible Barrier Packaging
ICS Number Code 83.180 (Adhesives)
UNSPSC Code 41113046(Adhesion tester)
|Link to Active (This link will always route to the current Active version of the standard.)|
ASTM D3808-01(2013), Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion, ASTM International, West Conshohocken, PA, 2013, www.astm.orgBack to Top