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Significance and Use
Accurate measurement of the volume resistivity of conductive adhesives is important, particularly with respect to applications in electronic packaging techniques. This method measures the resistance of conductive adhesives used in thin films as part of a bonded assembly. This does not imply that the measured results are applicable to different configurations with different metals. This method may be used for acceptance testing and for screening materials.
1.1 This test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is made on a thin adhesive layer as prepared in a bonded specimen. This test method is used for conductive adhesives that are cured either at room temperature or at elevated temperatures.
1.2 The values stated in either SI or other units shall be regarded separately as standard. SI equivalents to screw threads are shown in the figures.
1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
D618 Practice for Conditioning Plastics for Testing
D907 Terminology of Adhesives
Federal SpecificationQQ-B-626 Composition 22 Available from Standardization Documents Order Desk, DODSSP, Bldg. 4, Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http://dodssp.daps.dla.mil.
ICS Number Code 83.180 (Adhesives)
UNSPSC Code 31201601(Chemical adhesives)