Accurate measurement of the volume resistivity of conductive adhesives is important, particularly with respect to applications in electronic packaging techniques. This method measures the resistance of conductive adhesives used in thin films as part of a bonded assembly. This does not imply that the measured results are applicable to different configurations with different metals. This method may be used for acceptance testing and for screening materials.

1. Scope

1.1 This test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is made on a thin adhesive layer as prepared in a bonded specimen. This test method is used for conductive adhesives that are cured either at room temperature or at elevated temperatures.

1.2 The values stated in either SI or other units shall be regarded separately as standard. SI equivalents to screw threads are shown in the figures.

1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

Federal Specification

Index Terms

adhesive; conductive adhesive; conductivity; resistivity; volume resistivity; Adhesives; Adhesives (electrical insulation); Conductive adhesives; Electrical insulating adhesives; Electrical resistance/resistivity--adhesives; Resin-based adhesives; Volume resistivity;

ICS Code

ICS Number Code 83.180 (Adhesives)

Citing ASTM Standards

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