ASTM D1867 - 13

    Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

    Active Standard ASTM D1867 | Developed by Subcommittee: D09.07

    Book of Standards Volume: 10.01


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    Abstract

    This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following requirements: peel strength after solder float and at elevated temperature conditions; lengthwise and crosswise flexural strengths; flammability rating; water absorption; volume resistivity; dielectric breakdown parallel to laminations; dissipation factor; and permittivity. Warp or twist, and blistering requirements shall also be tested for conformance.

    This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.

    1. Scope

    1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

    1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

    1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.


    2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

    ASTM Standards

    D709 Specification for Laminated Thermosetting Materials

    D1711 Terminology Relating to Electrical Insulation

    D3636 Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials

    D5109 Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

    Other Standards

    MIL-P-13949 Plastic Sheet, Laminated, Metal Clad (for Printed Wiring Boards) Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700 Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.

    NEMAPublicationNumbe


    ICS Code

    ICS Number Code 31.180 (Printed circuits and boards)

    UNSPSC Code

    UNSPSC Code 32131000(Electronic component parts and raw materials and accessories); 26121517(Copper wire)


    Referencing This Standard

    DOI: 10.1520/D1867

    ASTM International is a member of CrossRef.

    Citation Format

    ASTM D1867-13, Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring, ASTM International, West Conshohocken, PA, 2013, www.astm.org

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