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This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not taken into account here. Solder alloys shall adhere to chemical composition requirements specified for the following flux types: Types R, RMA, and RA, which are composed of Grade WW or WG gum rosin; Type OA, which is composed of water-soluble organic materials; Type OS, which is composed of water-insoluble organic materials; and Type IS, which is composed of inorganic saltsor acids. Solders shall also meet physical property requirements such as paste texture, powder mesh size, viscosity, solder pool, and dryness, and pass performance requirements such as chlorides and bromides test, copper mirror test, and visual inspection. Other properties to which the alloys should conform to are dimensions and unit weights, spread factor, and resistivity of water extract.
This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
D269 Test Method for Insoluble Matter in Rosin and Rosin Derivatives
D464 Test Methods for Saponification Number of Naval Store Products Including Tall Oil and Other Related Products
D465 Test Methods for Acid Number of Naval Stores Products Including Tall Oil and Other Related Products
D509 Test Methods of Sampling and Grading Rosin
E28 Test Methods for Softening Point of Resins Derived from Naval Stores by Ring-and-Ball Apparatus
E29 Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
E46 Test Methods for Chemical Analysis of Lead- and Tin-Base Solder
E51 Method for Spectrographic Analysis of Tin Alloys by the Powder Technique
E55 Practice for Sampling Wrought Nonferrous Metals and Alloys for Determination of Chemical Composition
E87 Methods for Chemical Analysis of Lead, Tin, Antimony and Their Alloys (Photometric Method)
E88 Practice for Sampling Nonferrous Metals and Alloys in Cast Form for Determination of Chemical Composition
Federal StandardFed.Std.No.123 Marking for Shipment (Civil Agencies)
Military StandardMIL-STD-129 Marking for Shipment and Storage
ICS Number Code 77.120.40 (Nickel, chromium and their alloys)
ASTM B32-08(2014), Standard Specification for Solder Metal, ASTM International, West Conshohocken, PA, 2014, www.astm.orgBack to Top