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October 2003 Approved Standards Actions
A Committees B Committees C Committees D Committees
E Committees F Committees G Committees
F01 on Electronics

REAPPROVAL OF STANDARD
Volume 10.04, 2004
F 526-97 (2003)
F 616M-96 (2003)
F 676-97 (2003)
F 773M-96 (2003)
F 980M-96 (2003)
F 1259M-96 (2003)
F 1260M-96 (2003)
F 1261M-96 (2003)

WITHDRAWAL OF STANDARD
Volume 10.04, 2004
E 1392-96(2002), Practice for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces
F 26-87a(1999), Test Methods for Determining the Orientation of a Semiconductive Single Crystal
F 28-02, Test Methods for Minority-Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
F 42-02, Test Methods for Conductivity Type of Extrinsic Semiconducting Materials
F 43-99, Test Methods for Resistivity of Semiconductor Materials
F 81-01, Test Method for Measuring Radial Resistivity Variation on Silicon Wafers
F 84-02, Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point Probe
F 95-89(2000), Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer
F 110-00a, Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique
F 154-02, Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces
F 374-02, Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-line Four-Point Probe with the Single-Configuration Procedure
F 391-02, Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-State Surface Photovoltage
F 397-02, Test Method for Resistivity of Silicon Bars Using a Two-Point Probe
F 398-92(2002), Test Method for Majority Carrier Concentration in Semiconductors by Measurement of Wavenumber or Wavelength of the Plasma Resonance Minimum
F 399-00a, Test Method for Thickness of Heteroepitaxial or Polysilicon Layers
F 523-02, Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
F 525-00a, Test Method for Measuring Resistivity of Silicon Wafers Using a Spreading Resistance Probe
F 533-02a, Test Method for Thickness and Thickness Variation of Silicon Wafers
F 534-02a, Test Method for Bow of Silicon Wafers
F 576-01, Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry
F 657-92(1999), Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning
F 673-02, Test Methods for Measuring Resistivity of Semiconductor Slices or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage
F 728-81(2003), Practice for Preparing an Optical Microscope for Dimensional Measurements
F 847-02, Test Methods for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques
F 950-02, Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Slice Surface by Angle Polishing and Defect Etching
F 1049-02, Practice for Shallow Etch Pit Detection on Silicon Wafers
F 1153-92(2002), Test Method for Characterization of Metal-Oxide-Silicon Mos Structures by Capacitance-Voltage Measurements
F 1366-92(2002), Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry
F 1390-02, Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning
F 1392-02, Test Method for Determining Net Carrier Density Profiles in Silicon Wafers by Capacitance-Voltage Measurements with a Mercury Probe
F 1393-02, Test Method for Determining Net Carrier Density in Silicon Wafers by Miller Feedback Profiler Measurements with a Mercury Probe
F 1527-02, Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon
F 1530-02, Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
F 1617-98(2002), Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and Epi Substrates by Secondary Ion Mass Spectrometry
F 1618-02, Practice for Determination of Uniformity of Thin Films on Silicon Wafers
F 1621-96, Practice for Determining the Positional Accuracy Capabilities of a Scanning Surface Inspection System
F 1630-00, Test Method for Low Temperature Ft-ir Analysis of Single Crystal Silicon for Iii-V Impurities
F 1708-02, Practice for Evaluation of Granular Polysilicon by Melter-Zoner Spectroscopies
F 1723-02, Practice for Evaluation of Polycrystalline Silicon Rods by Float-Zone Crystal Growth and Spectroscopy
F 1724-01, Test Method for Measuring Surface Metal Contamination of Polycrystalline Silicon by Acid Extraction-Atomic Absorption Spectroscopy
F 1725-02, Guide for Analysis of Crystallographic Perfection of Silicon Ingots
F 1726-02, Guide for Analysis of Crystallographic Perfection of Silicon Wafers
F 1727-02, Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers
F 1763-96(2002), Test Methods for Measuring Contrast of a Linear Polarizer
F 1771-97(2002), Test Method for Evaluating Gate Oxide Integrity by Voltage Ramp Technique
F 1809-02, Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
F 1810-97(2002), Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers
F 1811-97(2002), Practice for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data
F 1982-99e1, Test Methods for Analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography F 2074-00, Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers
F 2139-01, Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry
F 2166-02, Practices for Monitoring Non-Contact Dielectric Characterization Systems Through Use of Special Reference Wafers

F02 on Flexible Barrier Materials

NEW STANDARD
Volume 15.09, 2004
F 2251-03, Test Method for Thickness Measurement of Flexible Packaging Material

F05 on Business Imaging Products

NEW STANDARD
Volume 15.09, 2004
F 2292-03, Practice for Determining the Waterfastness of Images Produced by Ink Jet Printers Utilizing Four Different Test Methods —Drip, Spray, Submersion and Rub
F 2293-03, Practice for Determining the Stain Resistance of Images Produced by Ink Jet Printers
F 2294-03, Practice for Determining the Writeability of Print Media

REAPPROVAL OF STANDARD
Volume 15.09, 2004
F 92-93 (2003)
F 221-98 (2003)
F 1294-97a(2003)
F 1851-98 (2003)
F 1943-98 (2003)

WITHDRAWAL OF STANDARD
Volume 15.09, 4
F 751-83(1997), Test Method for Measuring Particle Size of Wide-Size Range Dry Toners

F08 on Sports Equipment and Facilities

NEW STANDARD
Volume 15.07, 2003
F 2272-03, Specification for Paintball Markers Limited Modes
F 2273-03, Test Methods for Bicycle Forks
F 2274-03, Specification for Condition 3 Bicycle Forks

REVISION OF STANDARD
Volume 15.07, 2003
F 1015-03, Test Method for Relative Abrasiveness of Synthetic Turf Playing Surfaces

WITHDRAWAL OF STANDARD
Volume 15.07, 2003
F 1751-00, Specification for Helmets Used in Recreational Roller Skating

F15 on Consumer Products

EDITORIAL CHANGE
Volume 15.07, 2003
F 2085-03e1, Consumer Safety Specification for Portable Bed Rails

ADOPT AS A STANDARD
Volume 15.07, 2003
F 2234-03, Specification for Portable Gasoline and Kerosine Spill Resistant Fueling Systems for Consumer Use

F16 on Fasteners

NEW STANDARD
Volume 01.08, 2004
F 2282-03, Specification for Quality Assurance Requirements for Carbon and Alloy Steel Wire, Rods, and Bars for Mechanical Fasteners

REINSTATEMENT OF STANDARD WITH REVISION
Volume 01.08, 2004
A 502-03 (Includes change to title), Specification for Rivets, Steel, Structural

F17 on Plastic Piping Systems

NEW STANDARD
Volume 08.04, 2003
D 2513-03, Specification for Thermoplastic Gas Pressure Pipe, Tubing, and Fittings

REVISION OF STANDARD
Volume 08.04, 2000
D 2513-03a, Specification for Thermoplastic Gas Pressure Pipe, Tubing, and Fittings
F 2159-03, Specification for Plastic Insert Fittings Utilizing a Copper Crimp Ring for Sdr9 Cross-Linked Polyethylene (PEXTubing)
Volume 08.04, 2002
F 2080-02, Specification for Cold-Expansion Fittings with Metal Compression-Sleeves for Cross-Linked Polyethylene (PEXPipe)
Volume 08.04, 2003
F 1960-03, Specification for Cold Expansion Fittings with PEX Reinforcing Rings for Use with Cross-Linked Polyethylene (PEXTubing)

F23 on Protective Clothing

NEW STANDARD
Volume 11.03, 2003
F 2302-03, Performance Specification for Labeling Protective Clothing as Heat and Flame Resistant

F27 on Snow Skiing

REVISION OF STANDARD
Volume 15.07, 2003
F 1063-03, Practice for Functional Inspections and Adjustments of Alpine Ski/Binding/Boot Systems
F 1064-03, Practice for Sampling and Inspection of Complete and Incomplete Alpine Ski/Binding/Boot Systems in Rental Applications

F33 on Detention and Correctional Facilities

NEW STANDARD
Volume 15.08, 2003
F 2322-03, Test Methods for Physical Assault on Vertical Fixed Barriers for Detention and Correctional Facilities

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