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November/December 2008
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Solderability Applications

All interested parties are encouraged to participate in the development of a proposed new ASTM International standard, WK20460, Specification for High Performance Tinned Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability. The proposed standard is being developed by Subcommittee B01.04 on Conductors of Copper and Copper Alloys, which is part of ASTM International Committee B01 on Electrical Conductors.

According to Stephen Childers, process engineer, IWG High Performance Conductors Inc., and a member of Committee B01, many standards within the electrical conductor industry make reference to B33, Specification for Tinned Soft or Annealed Copper Wire for Electrical Purposes. However, B33 doesn’t cover the specifics for a tin- plated copper conductor intended to achieve solderability. WK20460 will cover specific requirements for solderability applications.

“Tin-plated copper conductors are currently used in the industry where solderability is required,” says Childers. “WK20460 will address the bare conductor requirements, quality test and inspection criteria for the solderability testing.” The proposed standard will have applications in both the electronics and aerospace industries.

Childers says that participation is encouraged for both the ongoing development of WK20460 and other proposed standards that fall within the scope of B01.04.

CONTACT

Technical Information: Stephen Childers, IWG High Performance Conductors Inc., Inman, S.C.

Phone: 864-472-0438

ASTM Staff: Jennifer Rodgers

Phone: 610-832-9694