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ASTM Packaging Committee Creates New Subcommittee for University Liaison
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 July 2006 Tech News

ASTM Packaging Committee Creates New Subcommittee for University Liaison

ASTM International Committee D10 on Packaging is currently inviting all interested parties to join a new D10 subcommittee, D10.97 on University Liaison.

According to S. Paul Singh, professor, school of packaging, Michigan State University, and chair of D10’s division I, the purpose of the new subcommittee is twofold. “We want to allow university programs that teach and research in packaging to be strongly involved in the development of new test methods and we want to allow student chapters to be created at member institutes to foster use of ASTM standards and processes early in their careers,” says Singh.

Singh says that the subcommittee will meet during D10 meetings and will be involved in round robin testing, the development of seminars on packaging issues and the creation of student chapters.

Subcommittee D10.97 is particularly interested in the participation of faculty members from universities and colleges that teach packaging. //

Contact:
Technical Information: S. Paul Singh, School of Packaging, Michigan State University, East Lansing, Mich.
Phone: 517/355-9580

ASTM staff: Thomas O’Toole
Phone: 610/832-9739

Upcoming Meeting:
Oct. 22-24, Atlanta, Ga., October Committee Week

 
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