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Global Notebook
IEC and IEEE Agreement Enhances Development of Global Electrotechnical Standards

A new cooperation agreement between the International Electrotechnical Commission (IEC) and the Institute of Electrical and Electronics Engineers (IEEE) seeks to enhance the creation of global technical standards. The agreement, which was signed at the IEC General Meeting in Beijing on Oct. 29, 2002, involves a dual-logo arrangement in which the logos of both organizations will appear on IEEE standards accepted and approved by the IEC.

Under the agreement, the IEC will evaluate new IEEE electronics, telecommunications, power generation and other electrotechnical standards for international status. To begin with, the IEC and IEEE will identify IEEE standards candidates for the IEC’s standardization process. The IEC Standardization Management Board will then decide which IEEE standards complement the IEC’s technical work program.

Those chosen will be processed by IEC technical committees and published as IEC/IEEE Dual Logo International Standards, available for adoption by IEC member countries as their national standards.

The dual-logo agreement also requires that the IEC and IEEE share any maintenance activity they perform on standards covered by the agreement to the benefit of the technical community.

Bryden Appointed New ISO Secretary-General

Mario Cortopassi, president of the International Organization for Standardization (ISO), has announced the appointment of Alan Bryden as the new ISO secretary-general. The decision was made at the 72nd ISO Council Meeting held in November 2002 in Geneva, Switzerland. Bryden, currently director-general of AFNOR, the French National Standards Body, will take office as ISO secretary-general on March 1. The office was vacated in 2002 at the passing of Lawrence D. Eicher, who held that post for 16 years.

Laboratory Accreditation Forum

The second annual U.S. Laboratory Accreditation Forum will be held March 17-18 in Columbia, Md. It will conclude with NACLA’s Annual General Meeting and Awards Luncheon. The event will be a gathering of representatives of accreditation bodies, testing and calibration laboratories, industrial firms and government agencies, all of which are stakeholders in the U.S. accreditation system. The Forum is an opportunity to learn about recent national and international developments in the dynamic field of accreditation and to share concerns and ideas. The 2003 speakers and panelists will address subjects such as the complimentary roles of certification and accreditation, prospects for the new common standard (ISO/IEC 17011), progress of accreditation body cooperations (ILAC, APLAC and IAAC), measurement uncertainty, and the special perspectives of laboratories, specifiers (government and industry) and accreditation bodies. Click here for more information.

Bilateral U.S./European Meeting of Standardization Officials

Officials of the European Committee for Standardization (CEN), the European Committee for Electrotechnical Standardization (CENELEC), and the European Telecommunications Standards Institute (ETSI), along with representatives of the European Commission (EC) and European Free Trade Association (EFTA), met with members of the American Nationals Standards Institute (ANSI) Federation in November 2002 in Washington, D.C., for the 17th bilateral meeting between American and European standardization organizations.

The meeting was the latest in a series of ongoing coordination dialogues between an ANSI delegation and the European Standards Organizations and the EC. It brought together more than 30 U.S. delegates, 20 European delegates and several ANSI staff to review opportunities for cooperation and collaboration between the regions to advance trade issues, protect the environment, develop more effective social initiatives, improve safety and health programs and make improvements in a score of other areas that will benefit the global economy while also resulting in the betterment of the lives of the world’s workers and consumers. ASTM President Jim Thomas was among the attendees.

Several topics discussed during the exchange focused on activities related to the International Organization for Standardization (ISO) and the International Electrotechnical Commission (IEC), including a discussion on respective developments in the global relevance of ISO, IEC and ITU deliverables to meet the needs of the global markets and regulators; the ISO pilot projects; and the IEC double-logo initiative.

Copyright 2003, ASTM