New Approaches in Investigation of Removal Mechanisms during Copper Chemical-Mechanical Polishing

Kulkarni, M
Department of Mechanical Engineering, Texas A & M University, College Station, TX, 77843-3123

Greisen, D
Department of Mechanical Engineering, Texas A & M University, College Station, TX, 77843-3123

Ng, D
Department of Mechanical Engineering, Texas A & M University, College Station, TX, 77843-3123

Liang, H
Corresponding author:, Department of Mechanical Engineering, Texas A & M University, College Station, TX, 77843-3123

(Received 19 January 2006; accepted 7 September 2006)
JOURNAL JAI
Abstract

This paper discusses new techniques for elucidating removal mechanisms of copper during chemical-mechanical polishing. Two new approaches were used in this research. One is the linkage between electrochemical, passivation, and wear for removal mechanisms. The other is to use an atomic force microscope to analyze polished copper surfaces at a nanometer length scale. Effects of pH, concentration of oxidizer, cathodic current, and amount of abrasive particles on surface materials removal were studied. Our investigation indicates that a balance between passivation and removal is needed to achieve a good localized planarization.

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Author Kulkarni, M Affiliation Department of Mechanical Engineering, Texas A & M University, College Station, TX, 77843-3123 Author Greisen, D Affiliation Department of Mechanical Engineering, Texas A & M University, College Station, TX, 77843-3123 Author Ng, D Affiliation Department of Mechanical Engineering, Texas A & M University, College Station, TX, 77843-3123 Author Liang, H Affiliation Corresponding author:, Department of Mechanical Engineering, Texas A & M University, College Station, TX, 77843-3123 Title: New Approaches in Investigation of Removal Mechanisms during Copper Chemical-Mechanical Polishing Symposium: , 0-0-0
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