SEDL / Topics / Electrical Insulation and Electronics / All JAI
Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications
Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures
Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders
Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
Wetting Behavior of Solders
The Contemporary Definition of Complex Relative Permittivity
Determination of Failure Criteria for Electric Cables Exposed to Fire for Use in a Nuclear Power Plant Risk Analysis
Smoke Toxicity Data for Fire Hazard and Risk Assessment of Cable Products
Fire Testing of Electrical and Optical Fiber Cables for Transportation Vehicles, Especially in North America
Modified Heat of Combustion Measurement for Electrical Communications and Optical Cables
High Throughput Flammability Characterization Using Gradient Heat Flux Fields