SEDL / Topics / Electrical Insulation and Electronics / Recent 25 JAI

• Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures
• Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications
• Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
• The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders
• Wetting Behavior of Solders
• Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
• The Contemporary Definition of Complex Relative Permittivity
• Determination of Failure Criteria for Electric Cables Exposed to Fire for Use in a Nuclear Power Plant Risk Analysis
• Smoke Toxicity Data for Fire Hazard and Risk Assessment of Cable Products
• Modified Heat of Combustion Measurement for Electrical Communications and Optical Cables
• Fire Testing of Electrical and Optical Fiber Cables for Transportation Vehicles, Especially in North America
• High Throughput Flammability Characterization Using Gradient Heat Flux Fields
• View All JAI