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• Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications
• Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
• The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders
• Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
• The Contemporary Definition of Complex Relative Permittivity
• Determination of Failure Criteria for Electric Cables Exposed to Fire for Use in a Nuclear Power Plant Risk Analysis
• Smoke Toxicity Data for Fire Hazard and Risk Assessment of Cable Products
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