SEDL / Topics / Electrical Insulation and Electronics / Electronics; Declarable Substances in Materials / Recently Published

Special Technical Publications (STPs)

• STP1530 Lead-free Solders
• STP1382 Gate Dielectric Integrity: Material, Process, and Tool Qualification
• STP1340 Recombination Lifetime Measurements in Silicon
• STP1141 Laser-Induced Damage in Optical Materials: 1990
• STP990 Semiconductor Fabrication: Technology and Metrology
• View Most Recent 25 STPs      View All STPs

Journal of ASTM International (JAI)

• Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures
• Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications
• Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
• The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders
• Wetting Behavior of Solders
• View Most Recent 25 JAI papers      View All JAI papers

Journal of Testing and Evaluation (JTE)

• Evaluation of A Humidity Sensor for Use in An Environment Exposed to Radiation
• Surface Roughness Measurement Using Laser Speckle Statistical Analysis
• Failure Analysis Using Microfocus X-ray Imaging
• Testing and Design of CMOS D-Latches
• Laser Evaluation of Cutting Angle and Surface Finish in Scalpel Blades
• View Most Recent 25 JTE papers      View All JTE papers