Digital Library / STP / STP994-EB

Current Trends in Protective Packaging of Computers and Electronic Components Peache RJ Pages: 72       Published: 1988

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Table of Contents

ESD Packaging and Handling Problemsthe Government Perspective of Causes and Cures
McGill R

Packing to Reduce Electrostatic Discharge Damage and Related Testing
Murello AF

FlammabilityA High Tech Packaging Issue
Crowley DP

Predicting Minimum Cushion Thicknesses
Fiedler RM

Predicting Field Performance from Laboratory Testing
Sheehan RL

A Comparison of Three Different Cushion Test Methods
Schueneman HH

Committee: D10
Paper ID: STP994-EB
DOI: 10.1520/STP994-EB

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0-8031-1171-1
978-0-8031-1171-4
STP994-EB