Digital Library / STP / STP994-EB
Current Trends in Protective Packaging of Computers and Electronic Components Peache RJ Pages: 72 Published: 1988
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Table of Contents ESD Packaging and Handling Problemsthe Government Perspective of Causes and Cures McGill R Packing to Reduce Electrostatic Discharge Damage and Related Testing Murello AF FlammabilityA High Tech Packaging Issue Crowley DP Predicting Minimum Cushion Thicknesses Fiedler RM Predicting Field Performance from Laboratory Testing Sheehan RL A Comparison of Three Different Cushion Test Methods Schueneman HH Committee: D10 Paper ID: STP994-EB DOI: 10.1520/STP994-EB ASTM International is a member of CrossRef. 0-8031-1171-1 978-0-8031-1171-4 STP994-EB