Current Trends in Protective Packaging of Computers and Electronic Components

    Peache RJ, O'Sullivan D
    Published: 1988

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    A collection of 6 papers by packaging experts on contemporary methods for protective packaging of electronic components subject to damage by shock and vibration and/or electrostatic discharge.

    Committee: D10

    DOI: 10.1520/STP994-EB

    ISBN-EB: 978-0-8031-5062-1

    ISBN-13: 978-0-8031-1171-4

    ASTM International is a member of CrossRef.