SEDL / STP / STP994-EB

STP994
Current Trends in Protective Packaging of Computers and Electronic Components

Peache RJ, O'Sullivan D
Pages: 72
Published: 1988

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A collection of 6 papers by packaging experts on contemporary methods for protective packaging of electronic components subject to damage by shock and vibration and/or electrostatic discharge.



Table of Contents

ESD Packaging and Handling Problems—the Government Perspective of Causes and Cures
McGill R.

Packing to Reduce Electrostatic Discharge Damage and Related Testing
Murello A.

Flammability—A High Tech Packaging Issue
Crowley D.

Predicting Minimum Cushion Thicknesses
Fiedler R.

Predicting Field Performance from Laboratory Testing
Sheehan R.

A Comparison of Three Different Cushion Test Methods
Schueneman H.

Committee: D10
Paper ID: STP994-EB
DOI: 10.1520/STP994-EB
ISBN-EB: 978-0-8031-5062-1

ASTM International is a member of CrossRef.
0-8031-1171-1
978-0-8031-1171-4
STP994-EB