You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.

    STP640

    Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings

    Mittal KL
    Published: 1978


      Format Pages Price  
    PDF (9.1M) $108   ADD TO CART
    Hardcopy (shipping and handling) $108   ADD TO CART
    Hardcopy + PDF Bundle - Save 25%
    (shipping and handling)
    $162.00   ADD TO CART


    Twenty-Five papers review and asses current measurement techniques, define problem areas and galvanize increased interest in developing better and more veritable techniques for adhesion measurement for thin films, thick films, and deposits and coatings.

    Table of Contents

    Introduction

    Summary

    Adhesion Measurement: Recent Progress, Unsolved Problems, and Prospects

    Locus of Failure and Its Implications for Adhesion Measurements

    Problems in Adhesion Measurement

    Experimental Methods to Determine Locus of Failure and Bond Failure Mechanism in Adhesive Joints and Coating-Substrate Combinations

    Thin-film Adhesion and Adhesive Failure—A Perspective

    Use of Fracture Mechanics Concepts in Testing of Film Adhesion

    Techniques for Measuring Adhesive Energies in Metal/Ceramic Systems

    Adhesion of Thin Plasma Polymer Films to Plastics

    Electromagnetic Tensile Adhesion Test Method

    Measurements of Film-Substrate Bond Strength by Laser Spallation

    Hardness and Adhesion of Filmed Structures as Determined by the Scratch Technique

    Threshold Adhesion Failure: An Approach to Aluminum Thin-Film Adhesion Measurement Using the Stylus Method

    Adhesion of Granular Thin Films

    Adhesion Measurement on Thin Evaporated Films

    Adhesion Measurements on Thick-Film Conductors

    Adhesion of Thick Films to Ceramic and Its Measurement by Both Destructive and Nondestructive Means

    Evaluation of Methods for Performing Adhesion Measurements of Thick-Film Terminations on Chip Components

    Adhesion Measurement Technique for Soldered Thick-Film Conductors

    Adhesion of Flame-Sprayed Coatings

    Adherence Measurements and Evaluation of Thick-Film Platinum-Gold

    Adhesion Testing of Deposit-Substrate Combinations

    Methods for Evaluating Adhesion of Photoresist Materials to Semiconductor Devices

    Effect of Aspect Ratio on Tensile Bond Strength for Butt Joint of Internal Fracture—Theoretical and Experimental Analysis

    Measuring the Temperature Dependence of the Strength of Metal-Polymer Joints

    Peel Test for Determining the Adhesion of Electrodeposits on Metallic Substrates

    Index


    Committee: C24

    DOI: 10.1520/STP640-EB

    ISBN-EB: 978-0-8031-5546-6

    ISBN-13: 978-0-8031-0272-9

    ASTM International is a member of CrossRef.

    0-8031-0272-0
    978-0-8031-0272-9
    STP640-EB