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Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings Mittal KL Pages: 401       Published: 1978

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Table of Contents

Introduction
Mittal KL

Summary
Mittal KL

Adhesion Measurement: Recent Progress, Unsolved Problems, and Prospects
Mittal KL

Locus of Failure and Its Implications for Adhesion Measurements
Good RJ

Problems in Adhesion Measurement
Bikerman JJ

Experimental Methods to Determine Locus of Failure and Bond Failure Mechanism in Adhesive Joints and Coating-Substrate Combinations
Baun WL

Thin-film Adhesion and Adhesive FailureA Perspective
Mattox DM

Use of Fracture Mechanics Concepts in Testing of Film Adhesion
Bascom WD, Becher PF, Bitner JL, Murday JS

Techniques for Measuring Adhesive Energies in Metal/Ceramic Systems
Murr LE

Adhesion of Thin Plasma Polymer Films to Plastics
Crane LW, Hamermesh CL

Electromagnetic Tensile Adhesion Test Method
Krongelb S

Measurements of Film-Substrate Bond Strength by Laser Spallation
Vossen JL

Hardness and Adhesion of Filmed Structures as Determined by the Scratch Technique
Ahn J, Mittal KL, MacQueen RH

Threshold Adhesion Failure: An Approach to Aluminum Thin-Film Adhesion Measurement Using the Stylus Method
Oroshnik J, Croll WK

Adhesion of Granular Thin Films
Faure R

Adhesion Measurement on Thin Evaporated Films
Kuwahara K, Hirota H, Umemoto N

Adhesion Measurements on Thick-Film Conductors
Hitch TT

Adhesion of Thick Films to Ceramic and Its Measurement by Both Destructive and Nondestructive Means
Morey RL

Evaluation of Methods for Performing Adhesion Measurements of Thick-Film Terminations on Chip Components
Ewell GJ

Adhesion Measurement Technique for Soldered Thick-Film Conductors
Leven SS

Adhesion of Flame-Sprayed Coatings
Ingham HS

Adherence Measurements and Evaluation of Thick-Film Platinum-Gold
Schroter S

Adhesion Testing of Deposit-Substrate Combinations
Dini JW, Johnson HR

Methods for Evaluating Adhesion of Photoresist Materials to Semiconductor Devices
Deckert CA

Effect of Aspect Ratio on Tensile Bond Strength for Butt Joint of Internal FractureTheoretical and Experimental Analysis
Masuoka M, Nakao K

Measuring the Temperature Dependence of the Strength of Metal-Polymer Joints
Egorenkov NI, Belyi VA

Peel Test for Determining the Adhesion of Electrodeposits on Metallic Substrates
Klingenmaier OJ, Dobrash SM

Index


Committee: C24
Paper ID: STP640-EB
DOI: 10.1520/STP640-EB

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0-8031-0272-0
978-0-8031-0272-9
STP640-EB