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SEDL / STP / STP640-EB
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STP640
Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings
Mittal KL
Pages: 401
Published: 1978
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Twenty-Five papers review and asses current measurement techniques, define problem areas and galvanize increased interest in developing better and more veritable techniques for adhesion measurement for thin films, thick films, and deposits and coatings.
Table of Contents
Introduction
Mittal K.
Summary
Mittal K.
Adhesion Measurement: Recent Progress, Unsolved Problems, and Prospects
Mittal K.
Locus of Failure and Its Implications for Adhesion Measurements
Good R.
Problems in Adhesion Measurement
Bikerman J.
Experimental Methods to Determine Locus of Failure and Bond Failure Mechanism in Adhesive Joints and Coating-Substrate Combinations
Baun W.
Thin-film Adhesion and Adhesive Failure—A Perspective
Mattox D.
Use of Fracture Mechanics Concepts in Testing of Film Adhesion
Bascom W., Becher P., Bitner J., Murday J.
Techniques for Measuring Adhesive Energies in Metal/Ceramic Systems
Murr L.
Adhesion of Thin Plasma Polymer Films to Plastics
Crane L., Hamermesh C.
Electromagnetic Tensile Adhesion Test Method
Krongelb S.
Measurements of Film-Substrate Bond Strength by Laser Spallation
Vossen J.
Hardness and Adhesion of Filmed Structures as Determined by the Scratch Technique
Ahn J., MacQueen R., Mittal K.
Threshold Adhesion Failure: An Approach to Aluminum Thin-Film Adhesion Measurement Using the Stylus Method
Croll W., Oroshnik J.
Adhesion of Granular Thin Films
Faure R.
Adhesion Measurement on Thin Evaporated Films
Hirota H., Kuwahara K., Umemoto N.
Adhesion Measurements on Thick-Film Conductors
Hitch T.
Adhesion of Thick Films to Ceramic and Its Measurement by Both Destructive and Nondestructive Means
Morey R.
Evaluation of Methods for Performing Adhesion Measurements of Thick-Film Terminations on Chip Components
Ewell G.
Adhesion Measurement Technique for Soldered Thick-Film Conductors
Leven S.
Adhesion of Flame-Sprayed Coatings
Ingham H.
Adherence Measurements and Evaluation of Thick-Film Platinum-Gold
Schroter S.
Adhesion Testing of Deposit-Substrate Combinations
Dini J., Johnson H.
Methods for Evaluating Adhesion of Photoresist Materials to Semiconductor Devices
Deckert C.
Effect of Aspect Ratio on Tensile Bond Strength for Butt Joint of Internal Fracture—Theoretical and Experimental Analysis
Masuoka M., Nakao K.
Measuring the Temperature Dependence of the Strength of Metal-Polymer Joints
Belyi V., Egorenkov N.
Peel Test for Determining the Adhesion of Electrodeposits on Metallic Substrates
Dobrash S., Klingenmaier O.
Index
Committee: C24
Paper ID: STP640-EB
DOI: 10.1520/STP640-EB
ISBN-EB: 978-0-8031-5546-6
 ASTM International is a member of CrossRef.
0-8031-0272-0
978-0-8031-0272-9
STP640-EB
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