SEDL / STP / STP319-EB
STP319 Papers on Soldering (1962) Committee B-2 Pages: 99 Published: 1963
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Table of Contents Introduction White P. Printed Wiring Surface Preparation Methods—Elimination of Gold Plating as a Surface Preparation for Printed Circuits and Development of a Contamination-Free Surface Keller J. Embrittlement of Solder by Gold from Plated Surfaces Foster F. Mechanism of Wetting During Solder Joint Formation Manko H. Effect of Impurities on Some Properties of Lead-Tin Alloys Heberlein M. Factors Affecting Quality of Soft Soldered Joints in Copper Water Tube Keyes J. Tin Transformation Of Tinned Copper Wire Spergel J. Committee: B02 Paper ID: STP319-EB DOI: 10.1520/STP319-EB ISBN-EB: 978-0-8031-6721-6 ASTM International is a member of CrossRef. 0-8031-6597-8 978-0-8031-6597-7 STP319-EB
