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Printed Wiring Surface Preparation Methods—Elimination of Gold Plating as a Surface Preparation for Printed Circuits and Development of a Contamination-Free SurfaceKeller J.
Embrittlement of Solder by Gold from Plated SurfacesFoster F.
Mechanism of Wetting During Solder Joint FormationManko H.
Effect of Impurities on Some Properties of Lead-Tin AlloysHeberlein M.
Factors Affecting Quality of Soft Soldered Joints in Copper Water TubeKeyes J.
Tin Transformation Of Tinned Copper WireSpergel J.
Paper ID: STP319-EB
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