Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover:
• Factors affecting the wetting behavior of solders and evolution of interfacial microstructure
• Pb-free high temperature solders for power semiconductor devices
• Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates
• Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling
• Microstructural aspects of the ductile-to-brittle transition
• Loading mixity on the interfacial failure mode in lead-free solder joint
• Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths.
• Effect of the morphology of Cu₆Sn₅ intermetallic compound on tensile properties of bulk solder and solder joint
• Tensile properties of Sn-10Sb-5Cu high temperature lead free solder
• Empirical modeling and rheological characterization of solder pastes used in electronic assemblies

STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry.