SEDL / STP / STP1530-EB
Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover:
Factors affecting the wetting behavior of solders and evolution of interfacial microstructure
Pb-free high temperature solders for power semiconductor devices
Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates
Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling
Microstructural aspects of the ductile-to-brittle transition
Loading mixity on the interfacial failure mode in lead-free solder joint
Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths.
Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint
Tensile properties of Sn-10Sb-5Cu high temperature lead free solder
Empirical modeling and rheological characterization of solder pastes used in electronic assemblies
STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry.
Table of Contents
Wetting Behavior of Solders
Kumar G., Prabhu K.
A Review of Pb-Free High-Temperature Solders for Power-Semiconductor Devices: Bi-Base Composite Solder and Zn-Al Base Solder
Atsumi T., Ishida K., Nakagawa I., Ohnuma I., Shirai M., Takaku Y., Yagi Y., Yamada Y.
Wetting Behaviour and Evolution of Microstructure of Sn-Ag-Zn Solders on Copper Substrates with Different Surface Textures
Prabhu K., Satyanarayan .
Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
Das D., Osterman M., Pecht M., Wang W.
The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders
Engelmaier W., Lambrinou K.
Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
Gao F., Jing J., Liang F., Qu J., Williams R.
Ball Grid Array Lead-Free Solder Joint Strength under Monotonic Flexural Load
Tensile Properties of Sn-10Sb-5Cu High Temperature Lead Free Solder
Gu X., Guo J., Liu X., Zeng Q., Zhu Q.
Empirical Modeling of the Time-Dependent Structural Build-Up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications
Bhatti R., Ekere N., Mallik S.
Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive Pastes
Durairaj R., Man L., Ramesh S.
Paper ID: STP1530-EB
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