STP1530

    Lead-free Solders

    Prabhu K.
    Published: 2011


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    Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover:
    • Factors affecting the wetting behavior of solders and evolution of interfacial microstructure
    • Pb-free high temperature solders for power semiconductor devices
    • Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates
    • Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling
    • Microstructural aspects of the ductile-to-brittle transition
    • Loading mixity on the interfacial failure mode in lead-free solder joint
    • Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths.
    • Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint
    • Tensile properties of Sn-10Sb-5Cu high temperature lead free solder
    • Empirical modeling and rheological characterization of solder pastes used in electronic assemblies

    STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry.



    Committee: F01

    Paper ID: STP1530-EB

    DOI: 10.1520/STP1530-EB

    ISBN-EB: 978-0-8031-8683-5

    ISBN-13: 978-0-8031-7516-7

    ASTM International is a member of CrossRef.


    978-0-8031-7516-7
    STP1530-EB