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Digital Library /STP / STP1413-EB
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Overview PDF
Description
Table of Contents
Surface Topology and Fatigue in Si MEMS Structures
Allameh SM, Gally B, Brown S, Soboyejo WO
Cross Comparison of Direct Strength Testing Techniques on Polysilicon Films
LaVan DA, Tsuchiya T, Coles G, Knauss WG, Chasiotis I, Read D
Fatigue and Fracture in Membranes for MEMS Power Generation
Bahr DF, Crozier BT, Richards CD, Richards RF
Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach
Ballarini R, Kahn H, Tayebi N, Heuer AH
Fatigue Crack Growth of a Ni-P Amorphous Alloy Thin Film
Takashima K, Shimojo M, Higo Y, Swain MV
Direct Tension and Fracture Toughness Testing Using the Lateral Force Capabilities of a Nanomechanical Test System
LaVan DA, Jackson K, McKenzie B, Glass SJ, Friedmann TA, Sullivan JP, Buchheit TE
Fracture Behavior of Micro-Sized Specimens with Fatigue Pre-Crack Prepared from a Ni-P Amorphous Alloy Thin Film
Takashima K, Shimojo M, Higo Y, Swain MV
Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale by the IMaP Methodology
de Boer MP, Smith NF, Masters ND, Sinclair MB, Pryputniewicz EJ
Influence of the Film Thickness on Texture, Residual Stresses and Cracking Behavior of PVD Tungsten Coatings Deposited on a Ductile Substrate
Ganne T, Farges G, Crépin J, Pradeilles-Duval R-M, Zaoui A
High Accuracy Measurement of Elastic Constants of Thin Films by Surface Brillouin Scattering
Beghi MG, Bottani CE, Pastorelli R
Effect of Nitrogen Feedgas Addition on the Mechanical Properties of Nano-Structured Carbon Coatings
Catledge SA, Vohra YK
Characterization of the Young's Modulus of CMOS Thin Films
Hossain N, Ju JW, Warneke B, Pister KSJ
Derivation of Elastic Properties of Thin Films from Measured Acoustic Velocities
Pastorelli R, Tarantola S, Beghi MG, Bottani CE, Saltelli A
Side-by-Side Comparison of Passive MEMS Strain Test Structures under Residual Compression
Masters ND, de Boer MP, Jensen BD, Baker MS, Koester D
Mechanical Tests of Free-Standing Aluminum Microbeams for MEMS Application
Zhang P, Lee H-J, Bravman JC
Tensile Testing of Thin Films Using Electrostatic Force Grip
Tsuchiya T, Sakata J
Tensile Tests of Various Thin Films
Sharpe WN, Jackson KM, Coles G, Eby MA, Edwards RL
Ductile Thin Foils of NiAl
Demura M, Kishida K, Umezawa O, George EP, Hirano T
Microstructural and Mechanical Characterization of Electrodeposited Gold Films
Long GS, Read DT, McColskey JD, Crago K
Determining the Strength of Brittle Thin Films for MEMS
Johnson GC, Jones PT, Wu M-T, Honda T
Thermomechanical Characterization of Nickel-Titanium Copper Shape Memory Alloy Films
Seward KP, Ramsey PB, Krulevitch P
Deformation and Stability of Gold/Polysilicon Layered MEMS Plate Structures Subjected to Thermal Loading
Dunn ML, Zhang Y, Bright VM
The Effects of Radiation on the Mechanical Properties of Polysilicon and Polydiamond Thin Films
Newton RL, Davidson JL
Author Index
Subject Index
Committee: E08
Paper ID: STP1413-EB
DOI: 10.1520/STP1413-EB
 ASTM International is a member of CrossRef.
0-8031-2889-4
978-0-8031-2889-7
STP1413-EB
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