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    Mechanical Properties of Structural Films

    Muhlstein CL, Brown SB
    Published: 2001

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    Written by an international group of experts from six countries.

    STP 1413 is one of the most complete assemblies of papers on the characterization of the mechanical properties of structural films available to date. In the rapidly developing field of structural films, this new ASTM publication is a milestone in the engineering of these materials systems and their characterization.

    22 papers cover four major areas of structural films characterization:

    • Fracture and Fatigue

    • Elastic Behavior and Residual Stress

    • Tensile Testing

    • Thermomechanical, Wear, and Radiation Damage

    Table of Contents

    Surface Topology and Fatigue in Si MEMS Structures

    Cross Comparison of Direct Strength Testing Techniques on Polysilicon Films

    Fatigue and Fracture in Membranes for MEMS Power Generation

    Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach

    Fatigue Crack Growth of a Ni-P Amorphous Alloy Thin Film

    Direct Tension and Fracture Toughness Testing Using the Lateral Force Capabilities of a Nanomechanical Test System

    Fracture Behavior of Micro-Sized Specimens with Fatigue Pre-Crack Prepared from a Ni-P Amorphous Alloy Thin Film

    Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale by the IMaP Methodology

    Influence of the Film Thickness on Texture, Residual Stresses and Cracking Behavior of PVD Tungsten Coatings Deposited on a Ductile Substrate

    High Accuracy Measurement of Elastic Constants of Thin Films by Surface Brillouin Scattering

    Effect of Nitrogen Feedgas Addition on the Mechanical Properties of Nano-Structured Carbon Coatings

    Characterization of the Young's Modulus of CMOS Thin Films

    Derivation of Elastic Properties of Thin Films from Measured Acoustic Velocities

    Side-by-Side Comparison of Passive MEMS Strain Test Structures under Residual Compression

    Mechanical Tests of Free-Standing Aluminum Microbeams for MEMS Application

    Tensile Testing of Thin Films Using Electrostatic Force Grip

    Tensile Tests of Various Thin Films

    Ductile Thin Foils of Ni3Al

    Microstructural and Mechanical Characterization of Electrodeposited Gold Films4

    Determining the Strength of Brittle Thin Films for MEMS

    Thermomechanical Characterization of Nickel-Titanium Copper Shape Memory Alloy Films

    Deformation and Stability of Gold/Polysilicon Layered MEMS Plate Structures Subjected to Thermal Loading

    The Effects of Radiation on the Mechanical Properties of Polysilicon and Polydiamond Thin Films

    Author Index

    Subject Index

    Committee: E08

    DOI: 10.1520/STP1413-EB

    ISBN-EB: 978-0-8031-5458-2

    ISBN-13: 978-0-8031-2889-7

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