Nontraditional Methods of Sensing Stress, Strain, and Damage in Materials and Structures

    McKeighan P., Lucas G., Ransom J.
    Published: 2001

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    The latest volume in this series examines new and nontraditional methods of measuring mechanical properties in materials and structures including: imaging systems to infer deformation fields, acoustic emission techniques, and unique applications and sensors. Many of these novel methods allow measurement of features and parameters that in the past have been difficult if not impossible to sense and distinguish.

    13 peer-reviewed papers are divided into 4 sections:

    • Fracture Mechanics and Structural Integrity

    • Damage Evolution and Measurement

    • Strain and Displacement Measurement Techniques

    • Current Status and Future Sensor Development: Panel Discussion Summary

    Table of Contents

    Current Status and Future Sensor Development: Panel Discussion Summary
    McKeighan P., Ransom J.

    Characterizing Crack Growth in Thin Aluminum Panels Under Tension-Torsion Loading Using Three-Dimensional Digital Image Correlation
    Boone M., Helm J., Sutton M.

    Sensing Crack Nucleation and Growth in Hard Alpha Defects Embedded in Ti-6A1-4V Alloy
    McClung R., McKeighan P., Nicholls A., Perocchi L.

    Use Experience With a Developmental General Purpose Non-Contacting Extensometer With High Resolution
    Adams R., Clarke A., Macdonald J., Potter K., Setchell C., Towse A., Wisnom M.

    Analysis of Fatigue Crack Propagation by Quantitative Fractography
    Benguediab M., Gerard N., Leroy R., Mazari M., Nadot Y., Petit J., Ranganathan N., Tougui A.

    A Comparison of Macroscopic to Microstructural Strain Fields in Cortical Bone
    Davy D., Lankford J., Nicholls A., Nicolella D.

    Detection of Localized Plastic Deformation in Pipelines Using the Nonlinear Harmonics Method
    Burkhardt G., Crouch A.

    Experimental Measurement of Strains using Digital Volume Correlation
    Bay B., Smith T.

    Measurement of Stress Distributions on Silicon IC Chips Using Piezoresistive Sensors
    Jaeger R., Suhling J.

    Real-time Phase Analysis Methods for Analyzing Shape, Strain and Stress
    Fujigaki M., Morimoto Y.

    Strain Gauges, Fiber Optic versus Electric
    Chen S., Sirkis J.

    Long-Term Measurement of Local Creep Deformation by Optical Fiber Marking and Remote Monitoring
    Gong J., He X., Ling X., Tu S.

    Thermal Fracture Mechanisms in Plasma Sprayed Thermal Barrier Coatings under Cyclic Laser Irradiation
    Ma X., Takemoto M.

    Committee: E08

    DOI: 10.1520/STP1323-EB

    ISBN-EB: 978-0-8031-6211-2

    ISBN-13: 978-0-8031-2882-8

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