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Fatigue of Electronic Materials Schroeder SA Pages: 154       Published: 1994

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Table of Contents

Creep-Fatigue Damage Analysis of Solder Joints
Ju SH, Kuskowski S, Sandor BI, Plesha ME

Creep-Fatigue Interactions in Eutectic Tin-Lead Solder Alloys
Kuo C-WG, Sastry SML, Jerina KL

A Unified Creep-Plasticity Theory for Solder Alloys
McDowell DL, Miller MP, Brooks DC

Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints
Pao Y-H, Badgley S, Govila R, Jih E

A Model for Primary Creep of 63Sn-37Pb Solder
Schroeder SA, Morris WL, Mitchell MR, James MR

Test Methodologies to Perform Valid Accelerated Thermomechanical Fatigue Tests of Solder Joints
Frear DR, Sorensen NR, Martens JS

High-Cycle Fatigue of Kovar
Wasynczuk JA, Hanna WD, Ross FD, Freitag TA

Thermal Stresses in Cooled Heat-Releasing Elements of Electronic Devices
Parnas A

Stress and Thermal Analysis of Resistance Temperature Detectors
Wilson DA, Katherisan A

Committee: E08
Paper ID: STP1153-EB
DOI: 10.1520/STP1153-EB

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0-8031-1994-1
978-0-8031-1994-9
STP1153-EB