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SEDL / STP / STP1153-EB
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STP1153
Fatigue of Electronic Materials
Schroeder SA, Mitchell MR
Pages: 154
Published: 1994
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Information from fatigue practitioners active in the microelectronics area that assess the current state and direction of fatigue/reliability research. 9 peer-reviewed papers provide: Valuable insight into the various methods in use to characterize the fatigue/creep interactions within solder under typical temperature and loading ranges of electronic systems Details on the complexity of fatigue/reliability testing of electronic component systems An excellent overview of the inherent complexities in accelerated fatigue testing of materials subject to high homologous temperatures and continual microstructural changes Examples of fatigue and creep characterization applied to reliability assessments of actual electronic components.
Table of Contents
Creep-Fatigue Damage Analysis of Solder Joints
Ju S., Kuskowski S., Sandor B., Plesha M.
Creep-Fatigue Interactions in Eutectic Tin-Lead Solder Alloys
Kuo C., Sastry S., Jerina K.
A Unified Creep-Plasticity Theory for Solder Alloys
McDowell D., Miller M., Brooks D.
Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints
Pao Y., Badgley S., Govila R., Jih E.
A Model for Primary Creep of 63Sn-37Pb Solder
Schroeder S., Morris W., Mitchell M., James M.
Test Methodologies to Perform Valid Accelerated Thermomechanical Fatigue Tests of Solder Joints
Frear D., Sorensen N., Martens J.
High-Cycle Fatigue of Kovar
Wasynczuk J., Hanna W., Ross F., Freitag T.
Thermal Stresses in Cooled Heat-Releasing Elements of Electronic Devices
Parnas A.
Stress and Thermal Analysis of Resistance Temperature Detectors
Wilson D., Katherisan A.
Committee: E08
Paper ID: STP1153-EB
DOI: 10.1520/STP1153-EB
ISBN-EB: 978-0-8031-5260-1
ASTM International is a member of CrossRef.
0-8031-1994-1
978-0-8031-1994-9
STP1153-EB
STP 1153
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