STP1153

    Fatigue of Electronic Materials

    Schroeder SA, Mitchell MR
    Published: 1994


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    Information from fatigue practitioners active in the microelectronics area that assess the current state and direction of fatigue/reliability research. 9 peer-reviewed papers provide:

    • Valuable insight into the various methods in use to characterize the fatigue/creep interactions within solder under typical temperature and loading ranges of electronic systems

    • Details on the complexity of fatigue/reliability testing of electronic component systems

    • An excellent overview of the inherent complexities in accelerated fatigue testing of materials subject to high homologous temperatures and continual microstructural changes

    • Examples of fatigue and creep characterization applied to reliability assessments of actual electronic components.



    Committee: E08

    Paper ID: STP1153-EB

    DOI: 10.1520/STP1153-EB

    ISBN-EB: 978-0-8031-5260-1

    ISBN-13: 978-0-8031-1994-9

    ASTM International is a member of CrossRef.

    0-8031-1994-1
    978-0-8031-1994-9
    STP1153-EB