STP1530: Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

    Wang, Weiqiang
    Univ. of Maryland, College Park, MD

    Osterman, Michael
    Univ. of Maryland, College Park, MD

    Das, Diganta
    Univ. of Maryland, College Park, MD

    Pecht, Michael
    City Univ. of Hong Kong, Kowloon, Hong Kong SAR,

    Pages: 15    Published: Jan 2011


    Abstract

    Tin-bismuth (SnBi) is a lead-free alternative to pure tin (Sn) lead-frame finish. SnBi finish is considered by some to be a tin-whisker mitigation strategy. In selecting a SnBi finish, the interfacial strength and reliability of solder interconnects formed with select assembly solders must be considered. To characterize the solder interconnect reliability of SnBi finished parts, sets of test assemblies were created with Sn and SnBi finished thin-small-outline-package (TSOP) parts using SAC305 and SnPb solder. Test assemblies were subjected to temperature cycling and interconnect strength tests. It was found that SnBi finish caused TSOP solder joints to have a shorter fatigue life than Sn finish under temperature cycling testing.

    Keywords:

    reliability, tin-bismuth, solder joint, temperature cycling, shear test


    Paper ID: STP49323S

    Committee/Subcommittee: F01.03

    DOI: 10.1520/STP49323S


    CrossRef ASTM International is a member of CrossRef.