SYMPOSIA PAPER Published: 01 January 2011
STP49321S

A Review of Pb-Free High-Temperature Solders for Power-Semiconductor Devices: Bi-Base Composite Solder and Zn-Al Base Solder

Source

Pb-base high-temperature solders (mass % Sn=5–10, melting point (m.p.)=300–310°C) are widely applied under severe conditions, although the harmful nature of Pb is recognized. Bi-base alloys (m.p. of Bi=270°C), Zn-base alloys (m.p. of Zn=420°C), and several Au-base eutectic alloys (m.p. of Au-20Sn and Au-3.6Si=280 and 363°C, respectively) are proposed as candidates for Pb-free high-temperature solders. This paper reviews the features of Bi-base composite solders containing reinforcement particles of a superelastic Cu-Al-Mn alloy in a Bi matrix to relax thermal stress and to prevent the propagation of cracks, and Zn-Al base solders, which have high stability and high reliability enough to be utilized in practical applications under severe thermal cycle tests between −40 and 230°C more than 2000 cycles.

Author Information

Takaku, Y.
Tohoku Univ., Sendai, Japan
Ohnuma, I.
Tohoku Univ., Sendai, Japan
Yamada, Y.
Toyota Central R&D Laboratories, Inc., Ai-chi, Japan
Yagi, Y.
Toyota Central R&D Laboratories, Inc., Ai-chi, Japan
Nakagawa, I.
Toyota Motor Corporation, Aichi, Japan
Atsumi, T.
Toyota Motor Corporation, Aichi, Japan
Shirai, M.
Toyota Motor Corporation, Aichi, Japan
Ishida, K.
Tohoku Univ., Sendai, Japan
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Details
Developed by Committee: F01
Pages: 27–49
DOI: 10.1520/STP49321S
ISBN-EB: 978-0-8031-8683-5
ISBN-13: 978-0-8031-7516-7