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Specimen Damage during Cutting and Grinding Pages: 7 Published: Jan 1964
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View License Agreement A detailed study has been made of the extent of deformation damage during mechanical and electrical spark cutting and planing of 3 1/4 per cent silicon iron during initial preparation of thin foil specimens. The results show the relation between rate of metal removal and depth of damaged layer, and demonstrate that under optimum conditions this layer can be as small as 5μ. | ||