SEDL / STP / STP572-EB / STP47409S



The Evaluation of Thin Silicon Layers by Spreading Resistance Measurements

Gruber, Gilbert A.
Solid State Measurements, Inc., Monroeville, Pennsylvania

Pfeifer, Robert F.
NCR Microelectronics Division, Miamisburg, Ohio


Pages: 8    Published: Jan 1974


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Abstract

The spreading resistance measurement technique is the only one capable of providing precise thickness measurements and detailed concentration profiles on any type of active device layer or structure formed in silicon on a routine basis. The methods employed in the evaluation of thin layer structures of the type used for microwave devices is discussed and the application of these methods to thin NN+, P+NN+ and P+N silicon structures formed by combinations of diffusion, epitaxy and ion implantation is illustrated.


Keywords:
Diffusion, epitaxy, ion implantation, microwave devices, profiling, spreading resistance, thin silicon layers

Paper ID: STP47409S
Committee/Subcommittee: F01.15
DOI: 10.1520/STP47409S
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