SEDL / STP / STP572-EB / STP47392S



Formal Comparison of Correction Formulae for Spreading Resistance Measurements on Layered Structures

Severin, P. J.
Philips Research Laboratories, Eindhoven,


Pages: 18    Published: Jan 1974


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Abstract

The spreading resistance of a metal contact on a semiconductor sample is analysed for infinite geometry, with three different boundary conditions: a specified potential of the contact, a uniform contact current density and a current density dependent on contact resistance. The cases of a thin layer on a perfectly conducting substrate and on a non-conducting substrate are analysed each for the boundary conditions of uniform current density and of the current density distribution valid for the infinite geometry. With a perfectly conducting substrate the two boundary conditions yield about 10% difference. With a non-conducting substrate calculations based on both current density distributions produce in the thin layer approximation the same In r dependence required. The constant terms in both approaches are different by 5% and the constant current density result in addition agrees with the result obtained with a totally different transmission-line approach. The actual three-point-probe measurement situation is discussed. The danger of correcting the precise spreading resistance measurement results with an error of 1%, with formulae derived on the basis of a formal model which is sensitive to the choice of the boundary conditions by up to 10%, is stressed. The effects of undefined thickness, bevel edge and transition layer curving upwards are mentioned as further complications.


Keywords:
Contact resistance, correction formulae, sheet resistance, silicon, spreading resistance

Paper ID: STP47392S
Committee/Subcommittee: F01.15
DOI: 10.1520/STP47392S
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