STP272: Stress-Rupture and Creep Properties of QMV Beryllium Metal

    Hurd, J. N.
    The Brush Beryllium Co., Cleveland, Ohio

    O'Rourke, R. G.
    The Brush Beryllium Co., Cleveland, Ohio

    Beaver, W. W.
    The Brush Beryllium Co., Cleveland, Ohio

    Pages: 21    Published: Jan 1960


    Abstract

    Data for the stress-rupture and creep properties of QMV beryllium and associated materials, including those of a higher oxide content, are presented. The temperature range covered was from room temperature to 1500 F. The data showed that the addition of the oxide improved the creep strength of the beryllium. The data are discussed from the viewpoint of describing some of the phenomenological aspects of the creep behavior of beryllium. In particular, a creep equation for elevated-temperature description is presented, and the variations of the parameters therein appearing are described. Attention is drawn to the effect of using creep stresses which exceed tensile elastic limits. Data correlations based on the creep equation and methods for calculating the activation energy for the creep of beryllium at elevated temperatures are given. The product of the minimum creep rates by the corresponding rupture times is discussed, and the conclusion is drawn that the activation energy for creep equals that for rupture.


    Paper ID: STP46332S

    Committee/Subcommittee: B02.10

    DOI: 10.1520/STP46332S


    CrossRef ASTM International is a member of CrossRef.