SEDL / STP / STP318-EB / STP46003S

Physical and Mechanical Properties of Electroformed Copper

Safranek, W. H.
Battelle Memorial Inst., Columbus, Ohio

Pages: 12    Published: Jan 1962

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Abstract

Temperature, current density, and other process variables influence the properties and the structures of electroformed copper. The effects of only a few addition agents have been evaluated. Data on the effects of impurities are lacking. Structures of typical electroformed copper are correlated in this discussion with the available data on properties.