SEDL / STP / STP319-EB / STP45806S

Embrittlement of Solder by Gold from Plated Surfaces

Foster, F. Gordon
Bell Telephone Laboratories, Murray Hill, N. J.

Pages: 7    Published: Jan 1963

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Abstract

Poor joints are often encountered when soldering gold-plated parts. Although the solder wets the parts, roughness, porosity, and brittleness may be present. This is particularly true where the gold plate is heavy and the amount of solder is small. Microscopic study shows the presence of long, hard, white crystals in the solder of such joints. The effects of various concentrations of gold in 60-40 tin-lead solder and in tin and lead are reported.