SEDL / STP / STP319-EB / STP45805S

Printed Wiring Surface Preparation Methods—Elimination of Gold Plating as a Surface Preparation for Printed Circuits and Development of a Contamination-Free Surface

Keller, J. D.
Group Engineer, Martin Co., Orlando,Fla.

Pages: 10    Published: Jan 1963

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Source: STP319-EB

Abstract

Soldering at Martin-Orlando is one of the most important operations in the production of missile weapon systems. To assure the ultimate in solderable surfaces it was felt that gold plating should be used. However, as printed wiring boards got into production, various puzzling defects entered the picture.

Paper ID: STP45805S
Committee/Subcommittee: B02.10
DOI: 10.1520/STP45805S
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