STP319

    Printed Wiring Surface Preparation Methods—Elimination of Gold Plating as a Surface Preparation for Printed Circuits and Development of a Contamination-Free Surface

    Published: Jan 1963


      Format Pages Price  
    PDF Version (604K) 10 $25   ADD TO CART
    Complete Source PDF (5.4M) 10 $55   ADD TO CART


    Abstract

    Soldering at Martin-Orlando is one of the most important operations in the production of missile weapon systems. To assure the ultimate in solderable surfaces it was felt that gold plating should be used. However, as printed wiring boards got into production, various puzzling defects entered the picture.


    Author Information:

    Keller, J. D.
    Group Engineer, Martin Co., Orlando, Fla.


    Paper ID: STP45805S

    Committee/Subcommittee: B02.10

    DOI: 10.1520/STP45805S


    CrossRef ASTM International is a member of CrossRef.