STP1480

    Finite Element Simulation of Dynamic Crack Propagation for Complex Geometries without Remeshing

    Published: Jan 2007


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    Abstract

    Simulation of the crack growth for complex geometries is presented in this paper. Determination of the crack propagation direction under mixed mode conditions is one of the most important parameters in fracture mechanics. There are several criteria that have been developed to predict crack growth and its direction using linear elastic fracture mechanics (LEFM), many of which have recently been incorporated into finite element codes. These criteria are commonly adopted in the prediction of crack propagation in simple geometries and in straight crack paths. In more complex geometries, a more accurate determination of the crack propagation path, using remeshing methods can be employed. However, the remeshing technique usually suffers from the loss of strain energy density that can occur at the tip of the crack during the interpolation of field solutions. In this research work, the crack growth simulation is presented which allows for crack path deviation without the use of remeshing of the model. This method deals with a nonstraight crack growth path, is based on a node releasing technique and appropriate fracture criteria. The maximum principal stress and maximum strain energy release rate criteria is used in this paper exclusively. The results of simulation have been compared with experimental results as well as with numerical works of others that have been found in the recently published literature.

    Keywords:

    finite element method, crack propagation, node releasing, maximum energy release rate, strain energy density


    Author Information:

    Biglari, Farid Reza
    Amirkabir University of Technology, Tehran,

    Rezaeinasab, Alireza
    Amirkabir University of Technology, Tehran,

    Nikbin, Kamran
    Imperial College, London,

    Sattarifar, Iradj
    Amirkabir University of Technology, Tehran,


    Paper ID: STP45531S

    Committee/Subcommittee: E08.06

    DOI: 10.1520/STP45531S


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