This paper deals only with thermoset phenolic-plywood bonds. Evidence is presented in support of the hypothesis that since per cent wood failure is more sensitive to initial bond degradation than is breaking load, a concerted effort should be made to make use of this potentially superior measure of bond quality. It is suggested that more research is necessary before the most efficient definition of per cent wood failure can be defined and the best possible standard of wood failure established; however, a preliminary standard is required before this research can be undertaken. The plea is made that ASTM begin preparation of the necessary temporary standard.