STP360

    Flexural Moduli and Deflection Temperatures of Various Epoxy Formulations

    Published: Jan 1964


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    Abstract

    Epoxy resins are continually being modified in order to achieve improved performance and processing. The effects on flexural modulus and deflection temperatures are studied for a system with an alumina filler and for one without an alumina filler at varying concentrations of the curing agent. In addition flexural moduli for seven flexibilized systems are studied at temperatures from −54 to +74C.


    Author Information:

    DeLollis, N. J.
    Materials Laboratory Div., Sandia Corp., Albuquerque, N. Mex.


    Paper ID: STP44565S

    Committee/Subcommittee: D14.60

    DOI: 10.1520/STP44565S


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