STP360: Flexural Moduli and Deflection Temperatures of Various Epoxy Formulations

    DeLollis, N. J.
    Materials Laboratory Div., Sandia Corp., Albuquerque, N. Mex.

    Pages: 6    Published: Jan 1964


    Abstract

    Epoxy resins are continually being modified in order to achieve improved performance and processing. The effects on flexural modulus and deflection temperatures are studied for a system with an alumina filler and for one without an alumina filler at varying concentrations of the curing agent. In addition flexural moduli for seven flexibilized systems are studied at temperatures from −54 to +74C.


    Paper ID: STP44565S

    Committee/Subcommittee: D14.60

    DOI: 10.1520/STP44565S


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