Published: Jan 1957
| ||Format||Pages||Price|| |
|PDF (124K)||7||$25||  ADD TO CART|
|Complete Source PDF (4.6M)||7||$60||  ADD TO CART|
In summarizing the results of the Symposium on Solders, Fluxes, and Evaluation of Joints in Solder Applications up to 800 F, it appears desirable to classify the papers presented into three major groups identified with the symposium theme. In the first group, on the general subject of solders, five papers have been presented: two on soldering aluminum, one on soldering printed circuits, one on soldering semiconductors, and one on paste solder alloys.
Harnden, G. H.
Supervisor, Materials and Processes, Engineering Standards Dept., General Electric Co.; Chairman Symposium Committee,