STP189: Dip-Soldered Printed Circuit Joint Characteristics

    Johns, Alfred A.
    Production Engineer, Navy Ordnance Div., Eastman Kodak Co., Rochester, N. Y.

    Miller, Eugen S.
    Production Engineer, Navy Ordnance Div., Eastman Kodak Co., Rochester, N. Y.

    Pages: 14    Published: Jan 1957


    Abstract

    Considerable emphasis has been placed upon a program of investigation of dipsoldered joints from the standpoint of results which can be anticipated in production. This program covers four fields of information on dip-soldered joints:

    1. Efficiency of joint formation.

    2. Short-time tensile strength.

    3. Impact strength in tension.

    4. Creep strength in tension.


    Paper ID: STP44115S

    Committee/Subcommittee: B02.02

    DOI: 10.1520/STP44115S


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