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Dip-Soldered Printed Circuit Joint Characteristics Pages: 14 Published: Jan 1957
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View License Agreement Considerable emphasis has been placed upon a program of investigation of dipsoldered joints from the standpoint of results which can be anticipated in production. This program covers four fields of information on dip-soldered joints: 1. Efficiency of joint formation. 2. Short-time tensile strength. 3. Impact strength in tension. 4. Creep strength in tension. | ||