STP189

    Dip-Soldered Printed Circuit Joint Characteristics

    Published: Jan 1957


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    Abstract

    Considerable emphasis has been placed upon a program of investigation of dipsoldered joints from the standpoint of results which can be anticipated in production. This program covers four fields of information on dip-soldered joints:

    1. Efficiency of joint formation.

    2. Short-time tensile strength.

    3. Impact strength in tension.

    4. Creep strength in tension.


    Author Information:

    Johns, Alfred A.
    Production Engineer, Navy Ordnance Div., Eastman Kodak Co., Rochester, N. Y.

    Miller, Eugen S.
    Production Engineer, Navy Ordnance Div., Eastman Kodak Co., Rochester, N. Y.


    Paper ID: STP44115S

    Committee/Subcommittee: B02.02

    DOI: 10.1520/STP44115S


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