STP271

    Elevated Temperature Resistant Metal-to-Metal Adiiesives Derived from Organic-Inorganic Polymer Systems

    Published: Jan 1961


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    Abstract

    Privent day organic adhesives for elevated temperature resistant metal-to-metal bonded structures are primarily of a phenolic or epoxy modified phenolic nature. Each can produce bonded joints able to withstand short time exposure at temperatures ranging from 500 F to 1000 F and still yield useful structural strength.


    Author Information:

    Janis, Edward C.
    Research Chemist, Narmco Industries, Inc., San Diego, Calif.


    Paper ID: STP42655S

    Committee/Subcommittee: D14.80

    DOI: 10.1520/STP42655S


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