SEDL / STP / STP271-EB / STP42655S

Elevated Temperature Resistant Metal-to-Metal Adiiesives Derived from Organic-Inorganic Polymer Systems

Janis, Edward C.
Research Chemist, Narmco Industries, Inc., San Diego, Calif.

Pages: 19    Published: Jan 1961

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Abstract

Privent day organic adhesives for elevated temperature resistant metal-to-metal bonded structures are primarily of a phenolic or epoxy modified phenolic nature. Each can produce bonded joints able to withstand short time exposure at temperatures ranging from 500 F to 1000 F and still yield useful structural strength.