Published: Jan 1961
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Privent day organic adhesives for elevated temperature resistant metal-to-metal bonded structures are primarily of a phenolic or epoxy modified phenolic nature. Each can produce bonded joints able to withstand short time exposure at temperatures ranging from 500 F to 1000 F and still yield useful structural strength.
Janis, Edward C.
Research Chemist, Narmco Industries, Inc., San Diego, Calif.
Paper ID: STP42655S