SEDL / STP / STP223-EB / STP42004S

Electrode Potential Method of Bond Testing

Marburger, W. G.
Argonne National Laboratory, Lemont, Ill.

Monaweck, J. H.
Argonne National Laboratory, Lemont, Ill.

McGonnagle, W. J.
Argonne National Laboratory, Lemont, Ill.

Pages: 8    Published: Jan 1958

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Abstract

The electrode potential method of bond testing utilizes the principle that the electrical resistivity in the immediate neighborhood of a flaw differs from that in solid metal. In this method, potential difference is used as a flaw indicator. Specially designed electrodes have reduced the disturbing effect of surface contact resistance common to resistance methods to a negligible factor and have made continuous semiautomatic scanning of a specimen possible. A pilot bond tester utilizing this method has been constructed and is described.