STP223

    Electrode Potential Method of Bond Testing

    Published: Jan 1958


      Format Pages Price  
    PDF (188K) 8 $25   ADD TO CART
    Complete Source PDF (13M) 8 $109   ADD TO CART


    Abstract

    The electrode potential method of bond testing utilizes the principle that the electrical resistivity in the immediate neighborhood of a flaw differs from that in solid metal. In this method, potential difference is used as a flaw indicator. Specially designed electrodes have reduced the disturbing effect of surface contact resistance common to resistance methods to a negligible factor and have made continuous semiautomatic scanning of a specimen possible. A pilot bond tester utilizing this method has been constructed and is described.


    Author Information:

    Marburger, W. G.
    Argonne National Laboratory, Lemont, Ill.

    Monaweck, J. H.
    Argonne National Laboratory, Lemont, Ill.

    McGonnagle, W. J.
    Argonne National Laboratory, Lemont, Ill.


    Paper ID: STP42004S

    Committee/Subcommittee: E07.07

    DOI: 10.1520/STP42004S


    CrossRef ASTM International is a member of CrossRef.