SEDL / STP / STP300-EB / STP41231S



Removal of Water-Soluble Flux from Assembled Printed Circuit Boards

Smallwood, Jack E.
Senior Project Engineer, Sonic Energy Engineering and Research, Pioneer-Central Division, The Bendix Corp., Davenport, Iowa


Pages: 7    Published: Jan 1961


Download this paper for $25 PDF (124K)          View License Agreement
Abstract

Most of the fluxes encountered in printed circuit work today are of the rosin or activated rosin types. The corrosivity of the residues from these fluxes has made it mandatory to remove them from critical assemblies. The difficulties encountered in the removal of rosin residues has led many manufacturers to consider the use of water-soluble organic fluxes in an attempt to lessen the problem. In addition, certain applications require fluxes which are more active than the rosin compounds.


Paper ID: STP41231S
Committee/Subcommittee: F01.10
DOI: 10.1520/STP41231S
CrossRef ASTM International is a member of CrossRef.