SEDL / STP / STP699-EB / STP38649S


Application of Surface Analysis for Electronic Devices

Holloway, PH
Associate professor, University of Florida, Gainesville, Fla.


Pages: 19    Published: Jan 1980


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Abstract

The principles of Auger electron spectroscopy, X-ray photoelectron spectroscopy, ion scattering spectroscopy, and secondary ion mass spectrometry are discussed, and their applications in the processing of electronic devices are illustrated. Electronic device processing is divided into five areas: (1) substrate and substrate processing, (2) deposited films, (3) patterning, (4) interconnection, and (5) compatibility. Examples are given in each area in which surface analysis has been used to great advantage in solving processing problems and improving technology.


Keywords:
surface analysis, electron devices, substrate, deposited films, patterning, bonding, soldering, Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), ion scattering spectroscopy (ISS), secondary ion mass spectrometry (SIMS)

Paper ID: STP38649S
Committee/Subcommittee: E42.03
DOI: 10.1520/STP38649S
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