Published: Jan 1980
| ||Format||Pages||Price|| |
|PDF ()||19||$25||  ADD TO CART|
|Complete Source PDF (3.4M)||19||$66||  ADD TO CART|
The principles of Auger electron spectroscopy, X-ray photoelectron spectroscopy, ion scattering spectroscopy, and secondary ion mass spectrometry are discussed, and their applications in the processing of electronic devices are illustrated. Electronic device processing is divided into five areas: (1) substrate and substrate processing, (2) deposited films, (3) patterning, (4) interconnection, and (5) compatibility. Examples are given in each area in which surface analysis has been used to great advantage in solving processing problems and improving technology.
surface analysis, electron devices, substrate, deposited films, patterning, bonding, soldering, Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), ion scattering spectroscopy (ISS), secondary ion mass spectrometry (SIMS)
Associate professor, University of Florida, Gainesville, Fla.