Published: Jan 1978
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Techniques for the measurement of adhesion of thick films to alumina have been evaluated. One method is to solder a connection into a thick film pad and measure strength using a force gage. By this method it is not possible to differentiate between inherent adhesion problems and soldering effects. Another method is to use a wire peel test, but it requires optimized procedures or the effects of soldering can mask the adhesion characteristics. Metallurgical sectioning with use of a scanning electron microscope (SEM) and energy dispersive X-ray (EDAX) attachment is an invaluable aid for examining the interface and determining the characteristics of glass and metal components. Bondability tests are also a means of evaluating adhesion but are affected by bonding technique and wire size. Standardized methods are needed for adhesion measurements which, coupled with a comprehensive quality-assurance procedure, can give full process control.
adhesion, thick films, tests, evaluation, bondability, quality control, substrates, dielectrics, measuring instruments
Paper ID: STP38635S