STP640: Adhesion of Granular Thin Films

    Faure, R
    Ingenieur au Centre National de la Recherche Scientifique Centre d'Etudes des Couches Minces, Laboratoire associe, C.N.R.S., Universite d'Aix-Marseille Ill, Marseille,

    Pages: 14    Published: Jan 1978


    Abstract

    With a view to measuring the adhesion of the microscopic metallic grains which constitute granular thin films, we have perfected a dynamic method. Very high accelerations (107 m/s2) are obtained by means of ultrasonic vibration amplifiers.

    Investigation of the adhesion of granular silver films deposited on carbon provided very interesting results: the presence of a coalescence phenomenon shows that there are interactions between grains. The adhesion varies according to the size of the grains, and is very low (150 N/m2) compared with that of thick films (5.0 × 106 N/m2).

    Finally, our measurement of the adhesion of thick films revealed that the break occurs in the silver very near the silver/carbon interface, and subsequent studies of the growth of silver/carbon show that the grains form on one or several monolayers of silver.

    Keywords:

    adhesion, thin films, granulation, adhesive face


    Paper ID: STP38632S

    Committee/Subcommittee: C24.30

    DOI: 10.1520/STP38632S


    CrossRef ASTM International is a member of CrossRef.