STP640: Use of Fracture Mechanics Concepts in Testing of Film Adhesion

    Bascom, WD
    Head, Adhesion and Polymer Composites Section, Polymeric Materials Branch, head, Ceramic Processing and Characterization Section, Ceramics Branch, research chemist, Adhesion and Polymer Composites Section, Polymeric Materials Branch, and head, Surface Analysis Section, Surface Chemistry Branch, Naval Research Laboratory, Washington, D.C.

    Becher, PF
    Head, Adhesion and Polymer Composites Section, Polymeric Materials Branch, head, Ceramic Processing and Characterization Section, Ceramics Branch, research chemist, Adhesion and Polymer Composites Section, Polymeric Materials Branch, and head, Surface Analysis Section, Surface Chemistry Branch, Naval Research Laboratory, Washington, D.C.

    Bitner, JL
    Head, Adhesion and Polymer Composites Section, Polymeric Materials Branch, head, Ceramic Processing and Characterization Section, Ceramics Branch, research chemist, Adhesion and Polymer Composites Section, Polymeric Materials Branch, and head, Surface Analysis Section, Surface Chemistry Branch, Naval Research Laboratory, Washington, D.C.

    Murday, JS
    Head, Adhesion and Polymer Composites Section, Polymeric Materials Branch, head, Ceramic Processing and Characterization Section, Ceramics Branch, research chemist, Adhesion and Polymer Composites Section, Polymeric Materials Branch, and head, Surface Analysis Section, Surface Chemistry Branch, Naval Research Laboratory, Washington, D.C.

    Pages: 19    Published: Jan 1978


    Abstract

    The constant-compliance and applied-moment double-cantilever beam tests for adhesive fracture energy have been adapted to the measurement of the adhesion of thick-film metallizations on alumina substrates. The thick-film tests involve beams soldered to metallization strips and measure the strain energy release rate, Gc The fracture results are compared with peel strengths from solder-wire peel tests of the same metallizations. Both the fracture and peel tests indicate failure in the thick films but near the film/alumina boundary. The constant-compliance and the peel test data exhibit a bimodal distribution. The magnitude of the fracture energies indicate that failure usually occurs in the glass phase of the film but that film adherence is greatly enhanced by interlocking between the metal and glass phases. This interlocking and thus the film adhesion are strongly dependent on firing time and temperature.

    Keywords:

    thick films, adhesion, fracture mechanics, adhesion testing, microelectronics, ceramic-metal bonding, fractography, thick film processing


    Paper ID: STP38625S

    Committee/Subcommittee: C24.30

    DOI: 10.1520/STP38625S


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