STP783: Composition and Structure of Dielectric Solids

    Tanaka, J
    Electrical Insulation Research Center, University of Connecticut, Storrs, Conn.

    Wolter, K
    Electrical Insulation Research Center, University of Connecticut, Storrs, Conn.

    Pages: 98    Published: Jan 1983


    Abstract

    The basis for understanding the nature of any material is understanding the atomic-molecular picture of that material. For any substance, the chemical and physical properties can only be appreciated when the arrangement of the atoms, the nature of the chemical bonds, and the relative size and shape of the arrays are understood. The reactivity of a compound can only be explained on the basis of structure. Thus thermal aging may becaused by oxidation, hydrolysis, cross-linking, or some other chemical process. These phenomena are ultimately understood when a chemical reaction with the standard chemical structural representations is written for the process. Physical properties such as dielectric constant, dielectric strength, tensile strength, and compressive strength are correlated with structure at the atomic level.


    Paper ID: STP37841S

    Committee/Subcommittee: D09.07

    DOI: 10.1520/STP37841S


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