STP876

    Designing to Minimize Peel Stresses in Adhesive-Bonded Joints

    Published: Jan 1985


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    Abstract

    The same analyses that show how severe the peel stresses can be in adhesively bonded test coupons indicate that those stresses can be reduced to insignificance in structurally configured joints. The successful design of adhesively bonded joints is shown to require the use of adequately long and thin overlaps to ensure that the development of parasitic peel stresses is suppressed, allowing the joint to develop the full shear strength of the adhesives or, better yet, the full strength of the adherends outside the bonded joint. The joint configurations discussed include single-lap joints, single-strap joints, double-lap joints, and skin-to-stiffener joints. The material presented includes both parametric solutions and specific joint analyses to quantify the issues.

    Keywords:

    adhesive bonding, adhesive joints, peel stresses, single-lap joints, single-strap joints, stress analysis, structural design, adhesive test coupons


    Author Information:

    Hart-Smith, LJ
    Douglas Aircraft Co., McDonnell Douglas Corp., Long Beach, CA


    Paper ID: STP36308S

    Committee/Subcommittee: D30.04

    DOI: 10.1520/STP36308S


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