STP876

    Evaluation of Tensile Tests for Adhesive Bonds

    Published: Jan 1985


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    Abstract

    Tensile adhesion tests have been used for many years as a quality control tool and to quantify the strength of a bond. The quantity generally reported as the tensile strength is the breaking force per unit bond area (average axial stress at the maximum load). The stress distribution in tensile adhesion tests, as discussed in this report, depends upon many factors such as material properties of the adherend and adhesive and the ratio of bond area to adhesive thickness. Test data are presented which demonstrate that the debond initiation point changes from the bond edge to the center of the bond area as the adhesive thickness is decreased. These test data confirm a prior prediction by the authors.

    The stress distribution and debond load were shown to be very sensitive to test specimen alignment during the tensile test. A test grip has been designed and used to alleviate effects of specimen misalignment. The effect of the modified test grip on tensile adhesion tests is discussed. A very large decrease in data variability as well as a 76% gain in apparent load carrying capability were observed when the modified test grip was used with brittle epoxy tensile adhesion test specimens.

    Keywords:

    adhesive bonding, tensile adhesion test, butt joint, stress analysis, fracture mechanics, testing, bond strength, finite element, fracture


    Author Information:

    Anderson, GP
    Senior Scientist, Morton-Thiokol, Inc., Brigham City, UT

    DeVries, KL
    Professor of Mechanical Engineering, University of Utah, Salt Lake City, UT

    Sharon, G
    Graduate Student, Mechanical Engineering, University of Utah, Salt Lake City, UT


    Paper ID: STP36302S

    Committee/Subcommittee: D30.04

    DOI: 10.1520/STP36302S


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