SYMPOSIA PAPER Published: 01 January 1983
STP36182S

Characterizing Process Nonuniformities on Large-Diameter Wafers: An Overview

Source

An overview is presented of the techniques available for characterizing process nonuniformities on large-diameter wafers. Examples are given of the use of two-dimensional and three-dimensional mapping techniques for displaying within-wafer variability, and of relative and cumulative frequency plots for representing process tolerances. Two new display methods are recommended for dealing with small data sets: minicontour maps and folded-axis cumulative frequency plots.

Author Information

Perloff, DS
Signetics Corporation, Sunnyvale, Calif. PROMETRIX Corp., Sunnyvale, Calif.
Price: $25.00
Contact Sales
Related
Reprints and Permissions
Reprints and copyright permissions can be requested through the
Copyright Clearance Center
Details
Developed by Committee: F01
Pages: 422–444
DOI: 10.1520/STP36182S
ISBN-EB: 978-0-8031-4871-0
ISBN-13: 978-0-8031-0243-9